Areal Confocal 3D Microscope

Used to wafers, substrates, HDI boards, flexible printed circuits, glass wafers, glass substrates, microprisms, PV panels, Li batteries and etc.

Suitable for critical dimension measurement of semiconductor wafer patterns, solder ball, probe indentation and MEMS device 

Using structured light illumination and vertical axial scanning to realize micro-surface 3D topography 

Sub-nanometer vertical resolution

Motorized XY stage 

The Z-axis motor driver and piezoelectric ceramic (PZT) are adjustable

Including mountains analysis software; measurement results can be exported as reports

The 3D tilt measurement angle is up to ±60°

Supportint focus stacking, motorized XY stitching, and measurement after stitching

Capable of measuring workpieces with a maximum aspect ratio of 1:10

Supporting color imaging and 2D/3D observation, synchronously outputting 3D point cloud data, 2D color images and focus-stacked images

Single-field-of-view measurement of multi-material and multi-color surfaces, compatible with reflective, metallic, highly reflective and transparent substrates